Multilayer Polyimide Protection FPC Film Electrical Insulation Tape Odm

Product Overview

This advanced polyimide coverlay film represents a breakthrough in circuit protection technology, combining a ultra-thin polyimide core (8-25μm) with functional adhesive layers to provide comprehensive protection for high-density circuits. Featuring 50% better flexibility and 40% higher temperature resistance than standard coverlay films, it offers superior solder mask replacement capability while ensuring long-term reliability in demanding applications. The material's unique multi-layer construction provides simultaneous electrical insulation, mechanical protection, and environmental sealing for next-generation electronics.

Breakthrough Performance Advantages

1. Exceptional Thin-Film Performance

   • Ultra-thin construction (8-25μm) enables bending radii down to 0.1mm

   • 60% improvement in flexibility compared to standard coverlay films

   • Maintains integrity through 100,000+ dynamic flex cycles

2. Advanced Thermal Management

   • Withstands 10× reflow cycles at 260°C without degradation

   • Continuous service temperature from -269°C to 280°C

   • Thermal conductivity 0.8 W/m·K (3× conventional coverlay materials)

3. Superior Protection Properties

   • Dielectric strength >6.5 kV/mm for reliable electrical isolation

   • Chemical resistance to fluxes, solvents, and cleaning agents

   • Moisture absorption <0.3% (50% lower than standard films)

4. Enhanced Processing Characteristics

   • Laser drillable with 15μm via capability for fine-pitch components

   • Excellent dimensional stability (±0.05%) during lamination processes

   • Compatible with automated application equipment for high-volume production

Target Applications

• High-Density Flexible Circuits

  • Solder mask replacement for fine-pitch BGA and CSP components

  • Protection layer for ultra-thin flexible printed circuits

  • Coverlay for rigid-flex board transition areas

• Advanced Electronics Packaging

  • Semiconductor device protection and insulation

  • MEMS and sensor packaging encapsulation

  • RF/microwave circuit shielding and protection

• Demanding Environment Applications

  • Automotive electronics under-hood protection

  • Aerospace and defense circuit protection systems

  • Medical implantable device encapsulation

• Consumer Electronics

  • Wearable device circuit protection

  • Foldable display circuit insulation

  • High-reliability mobile device circuitry